WBM-WN1200

Applications

• Semiconductor and precision parts
• Parts that distort under heat
• Parts that need washing after dry blasting

Features

• Little surface heat during blasting, so parts do not distort
• Keeps stress in the part to a minimum
• A consistent film during blasting makes the depth easy to control
• More accurate alignment than dry blasting
• Smaller footprint than a dry-type machine
• No airborne dust, so the workplace stays clean
• Handles very fine media easily
• No static build-up in operation
• Contamination is washed off at the same time
• The media does not embed in the surface

Specifications

※ Specifications can be adjusted to suit the customer's requirements.